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Yinxiao Feng

Ph.D. Student
Tsinghua University
fyx20@mails.tsinghua.edu.cn


About Me

I am a fourth year Ph.D. candidate in Computer Science and Technology at the Institute for Interdisciplinary Information Sciences (IIIS), Tsinghua University (THU). I am advised by assistant Prof. Kaisheng Ma and also work closely with Prof. Dong Xiang and Prof. Torsten Hoefler. I received my bachelor’s degree in Information Engineering with Zhiyuan honor degree and second bachelor’s degree in Mathematics and Applied Mathematics at Shanghai Jiaotong University (SJTU).

I am looking for job opportunities

Research Interests

News

Publications

  1. Ring Road: A Scalable Polar-Coordinate-based 2D Network-on-Chip Architecture
    Yinxiao Feng*, Wei Li*, Kaisheng Ma (*Co-First)
    57th IEEE/ACM International Symposium on Microarchitecture (MICRO), 2024.
    CCF-A, 22.7% (113/497)

  2. Switch-Less Dragonfly on Wafers: A Scalable Interconnection Architecture based on Wafer-Scale Integration
    Yinxiao Feng, Kaisheng Ma
    The International Conference for High Performance Computing, Networking, Storage, and Analysis (SC), 2024.
    CCF-A

  3. Evaluating Chiplet-based Large-Scale Interconnection Networks via Cycle-Accurate Packet-Parallel Simulation
    Yinxiao Feng, Yuchen Wei, Dong Xiang, Kaisheng Ma
    USENIX Annual Technical Conference (ATC), 2024.
    Paper CCF-A, 15.8% (77/488)

  4. MICRO
    Heterogeneous Die-to-Die Interfaces: Enabling More Flexible Chiplet Interconnection Systems
    Yinxiao Feng, Dong Xiang, Kaisheng Ma
    56th Annual IEEE/ACM International Symposium on Microarchitecture (MICRO), 2023.
    Paper CCF-A, 23.8% (101/424)

  5. HPCA
    A Scalable Methodology for Designing Efficient Interconnection Network of Chiplets
    Yinxiao Feng, Dong Xiang, Kaisheng Ma
    IEEE International Symposium on High-Performance Computer Architecture (HPCA), 2023.
    Paper CCF-A, 25% (91/364)

  6. DAC
    Chiplet Actuary: A Quantitative Cost Model and Multi-Chiplet Architecture Exploration
    Yinxiao Feng, Kaisheng Ma
    Proceedings of the 59th ACM/IEEE Design Automation Conference (DAC), 2022.
    Paper Code CCF-A, 23%

  7. A Low-Power Ultra-Compact Ultrasonic Communication System for Neural Spike Events Recording
    Qichao Ma, Yinxiao Feng, Kaisheng Ma
    IEEE International Ultrasonics Symposium (IUS), 2021.
    Paper

  8. Bipolar Resistive Switching in the Ag/Sb2Te3/Pt Heterojunction
    Zhenhua Wu, Yinxiao Feng, Yan Liu, Huilie Shi, Shuai Zhang, Zekun Liu, Zhiyu Hu
    ACS Applied Electronic Materials, 2021.
    Paper

Teaching